Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Li, Chun-Hsing | en_US |
dc.contributor.author | Wu, Jan-Jr | en_US |
dc.contributor.author | Kuo, Chien-Nan | en_US |
dc.contributor.author | Cheng, Yu-Ting | en_US |
dc.contributor.author | Kuo, Ming-Ching | en_US |
dc.date.accessioned | 2017-04-21T06:49:15Z | - |
dc.date.available | 2017-04-21T06:49:15Z | - |
dc.date.issued | 2013 | en_US |
dc.identifier.isbn | 978-1-4673-2141-9 | en_US |
dc.identifier.isbn | 978-1-4673-6177-4 | en_US |
dc.identifier.issn | 0149-645X | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/136051 | - |
dc.description.abstract | A broadband interconnect for THz heterogeneous system integration is proposed using a resonator coupling technique. Two resonators, deployed on a chip and a carrier, respectively, are coupled through the electromagnetic field to provide a low-loss interconnect in a broadband manner. Simulation results indicate an insertion loss of 0.32 dB at 170 GHz while covering 3-dB bandwidth from 100 to 344 GHz. Measurement can be conducted to verify its performance only from 140 GHz to 220 GHz, due to equipment limit. The measured minimum insertion loss is 0.47 dB at 164 GHz. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Broadband | en_US |
dc.subject | interconnect | en_US |
dc.subject | THz | en_US |
dc.subject | heterogeneous integration | en_US |
dc.title | A Broadband Interconnect for THz Heterogeneous System Integration | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2013 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (IMS) | en_US |
dc.contributor.department | 電機工程學系 | zh_TW |
dc.contributor.department | Department of Electrical and Computer Engineering | en_US |
dc.identifier.wosnumber | WOS:000369754300215 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Conferences Paper |