完整後設資料紀錄
DC 欄位語言
dc.contributor.authorLi, Chun-Hsingen_US
dc.contributor.authorWu, Jan-Jren_US
dc.contributor.authorKuo, Chien-Nanen_US
dc.contributor.authorCheng, Yu-Tingen_US
dc.contributor.authorKuo, Ming-Chingen_US
dc.date.accessioned2017-04-21T06:49:15Z-
dc.date.available2017-04-21T06:49:15Z-
dc.date.issued2013en_US
dc.identifier.isbn978-1-4673-2141-9en_US
dc.identifier.isbn978-1-4673-6177-4en_US
dc.identifier.issn0149-645Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/136051-
dc.description.abstractA broadband interconnect for THz heterogeneous system integration is proposed using a resonator coupling technique. Two resonators, deployed on a chip and a carrier, respectively, are coupled through the electromagnetic field to provide a low-loss interconnect in a broadband manner. Simulation results indicate an insertion loss of 0.32 dB at 170 GHz while covering 3-dB bandwidth from 100 to 344 GHz. Measurement can be conducted to verify its performance only from 140 GHz to 220 GHz, due to equipment limit. The measured minimum insertion loss is 0.47 dB at 164 GHz.en_US
dc.language.isoen_USen_US
dc.subjectBroadbanden_US
dc.subjectinterconnecten_US
dc.subjectTHzen_US
dc.subjectheterogeneous integrationen_US
dc.titleA Broadband Interconnect for THz Heterogeneous System Integrationen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2013 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST (IMS)en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000369754300215en_US
dc.citation.woscount0en_US
顯示於類別:會議論文