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dc.contributor.authorLiao, Chien-Huien_US
dc.contributor.authorLin, Yu-Zeen_US
dc.contributor.authorWen, Charles H. -P.en_US
dc.date.accessioned2017-04-21T06:48:29Z-
dc.date.available2017-04-21T06:48:29Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4799-6275-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/136077-
dc.description.abstractThermal-constrained task scheduler for throughput optimization on 3D multi-core processors (3D-MCPs) has been studied extensively. Most task scheduler focused on thermal-aware task allocation to reduce hotspots, thereby maximizing throughput under thermal constraints. Rather than focusing on the thermal-aware task allocation as previous work does, this work targets on the voltage assignment. In this paper, dynamic voltage assignment is proposed to pre-emptively assign different voltage levels to cores frequently for reducing temperature increase in 3D-MCPs. Experimental results show that two previous task schedulers integrated with the proposed dynamic voltage assignment can lower hotspot occurrences by 62.31% and 59.09%, and improve throughput by 18.28% and 18.35%, respectively. As a result, task schedulers integrated with the proposed dynamic voltage assignment can be more effective to reduce occurrences of hotspots and optimize throughput for 3D-MCPs under thermal constraints.en_US
dc.language.isoen_USen_US
dc.titleDynamic Voltage Assignment for Thermal-Constrained Task Scheduler on 3D Multi-Core Processorsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2015 International symposium on VLSI Design, Automation and Test (VLSI-DAT)en_US
dc.contributor.department傳播研究所zh_TW
dc.contributor.department資訊工程學系zh_TW
dc.contributor.departmentInstitute of Communication Studiesen_US
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.identifier.wosnumberWOS:000380584400002en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper