完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Huang, SY | en_US |
dc.contributor.author | Chen, KM | en_US |
dc.contributor.author | Huang, GW | en_US |
dc.contributor.author | Liang, V | en_US |
dc.contributor.author | Tseng, HC | en_US |
dc.contributor.author | Hsu, TL | en_US |
dc.contributor.author | Chang, CY | en_US |
dc.date.accessioned | 2014-12-08T15:18:55Z | - |
dc.date.available | 2014-12-08T15:18:55Z | - |
dc.date.issued | 2005-06-01 | en_US |
dc.identifier.issn | 1530-4388 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/TDMR.2005.846829 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/13609 | - |
dc.description.abstract | Hot-carrier (HC) effects on high-frequency and RF power characteristics of Si/SiGe HBTs are investigated in this paper. By using the two-tone load-pull measurement, we find that not only the cutoff frequency, but also the output power performances of Si/SiGe HBTs are suffered by the HC stress. In this work, S-parameters and intrinsic elements of an equivalent hybrid-pi model were used to validate the HC effects on high-frequency characteristics. With different bias conditions, the degradations of cutoff frequency, power gain, and linearity are found to be worse under constant base-current measurement than that under constant collector-current measurement. The HC-induced degradations on the current gain, transconductance, and ideality-factor of base and collector currents are analyzed to explain the experimental observations. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | cut-off frequency | en_US |
dc.subject | hot-carrier effect | en_US |
dc.subject | linearity | en_US |
dc.subject | power gain | en_US |
dc.subject | power-added efficiency | en_US |
dc.subject | SiGeHBT | en_US |
dc.title | Hot-carrier induced degradations on RF power characteristics of SiGe heterojunction bipolar transistors | en_US |
dc.type | Article; Proceedings Paper | en_US |
dc.identifier.doi | 10.1109/TDMR.2005.846829 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY | en_US |
dc.citation.volume | 5 | en_US |
dc.citation.issue | 2 | en_US |
dc.citation.spage | 183 | en_US |
dc.citation.epage | 189 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000230223000004 | - |
顯示於類別: | 會議論文 |