完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Yao, Jing-Neng | en_US |
dc.contributor.author | Lin, Yueh-Chin | en_US |
dc.contributor.author | Chuang, Yu-Lin | en_US |
dc.contributor.author | Huang, Yu-Xiang | en_US |
dc.contributor.author | Shih, Wang-Cheng | en_US |
dc.contributor.author | Sze, Simon M. | en_US |
dc.contributor.author | Chang, Edward Yi | en_US |
dc.date.accessioned | 2017-04-21T06:49:50Z | - |
dc.date.available | 2017-04-21T06:49:50Z | - |
dc.date.issued | 2015 | en_US |
dc.identifier.isbn | 978-1-4799-9928-6 | en_US |
dc.identifier.issn | 1946-1550 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/136108 | - |
dc.description.abstract | We demonstrate the Au-free GaN HEMT device with the Ti/Al/W Ohmic metal structure. Excellent surface roughness 4.88nm for Ti/Al/W Ohmic stucture was achieved after metallization. The DC characteristics is comparable with conventional HEMTs and the stress performance with high voltage is better than conventional HEMTs. | en_US |
dc.language.iso | en_US | en_US |
dc.title | An Au-free GaN High Electron Mobility Transistor with Ti/Al/W Ohmic Metal Structure | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015) | en_US |
dc.citation.spage | 394 | en_US |
dc.citation.epage | 397 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | 光電系統研究所 | zh_TW |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.contributor.department | Institute of Photonic System | en_US |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000380466200100 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 會議論文 |