完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Xu, Wei | en_US |
dc.contributor.author | Gao, Bo | en_US |
dc.contributor.author | Ma, Shenhui | en_US |
dc.contributor.author | Zhang, Anping | en_US |
dc.contributor.author | Chiu, Yi | en_US |
dc.contributor.author | Lee, Yi-Kuen | en_US |
dc.date.accessioned | 2017-04-21T06:49:52Z | - |
dc.date.available | 2017-04-21T06:49:52Z | - |
dc.date.issued | 2016 | en_US |
dc.identifier.isbn | 978-1-5090-1973-1 | en_US |
dc.identifier.issn | 1084-6999 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/136180 | - |
dc.description.abstract | In this paper, a low-cost Temperature-compensated Thermoresistive Micro Calorimetric Flow ((TMCF)-M-2) sensor by using a commercial 0.35 mu m 2P4M CMOS MEMS technology is reported. For nitrogen flow, the fabricated (TMCF)-M-2 sensor achieves a normalized sensitivity of 230 mV/(m/s)/mW with respect to the input heating power, which is two orders of magnitude better than the reported micro calorimetric flow sensors. The experimental results of (TMCF)-M-2 sensor under different ambient temperatures T-a of 22 degrees C similar to 48 degrees C showed the excellent temperature insensitive output with the maximum normalized variation of 0.5%. Compared to the uncompensated counterpart (49%), it demonstrates our robust (TMCF)-M-2 sensor design is applicable for the integration of on-chip CMOS electronics for the Internet of Things. | en_US |
dc.language.iso | en_US | en_US |
dc.title | LOW-COST TEMPERATURE-COMPENSATED THERMORESISTIVE MICRO CALORIMETRIC FLOW SENSOR BY USING 0.35 mu m CMOS MEMS TECHNOLOGY | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2016 IEEE 29TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) | en_US |
dc.citation.spage | 189 | en_US |
dc.citation.epage | 192 | en_US |
dc.contributor.department | 交大名義發表 | zh_TW |
dc.contributor.department | National Chiao Tung University | en_US |
dc.identifier.wosnumber | WOS:000381797300050 | en_US |
dc.citation.woscount | 1 | en_US |
顯示於類別: | 會議論文 |