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dc.contributor.authorXu, Weien_US
dc.contributor.authorGao, Boen_US
dc.contributor.authorMa, Shenhuien_US
dc.contributor.authorZhang, Anpingen_US
dc.contributor.authorChiu, Yien_US
dc.contributor.authorLee, Yi-Kuenen_US
dc.date.accessioned2017-04-21T06:49:52Z-
dc.date.available2017-04-21T06:49:52Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-5090-1973-1en_US
dc.identifier.issn1084-6999en_US
dc.identifier.urihttp://hdl.handle.net/11536/136180-
dc.description.abstractIn this paper, a low-cost Temperature-compensated Thermoresistive Micro Calorimetric Flow ((TMCF)-M-2) sensor by using a commercial 0.35 mu m 2P4M CMOS MEMS technology is reported. For nitrogen flow, the fabricated (TMCF)-M-2 sensor achieves a normalized sensitivity of 230 mV/(m/s)/mW with respect to the input heating power, which is two orders of magnitude better than the reported micro calorimetric flow sensors. The experimental results of (TMCF)-M-2 sensor under different ambient temperatures T-a of 22 degrees C similar to 48 degrees C showed the excellent temperature insensitive output with the maximum normalized variation of 0.5%. Compared to the uncompensated counterpart (49%), it demonstrates our robust (TMCF)-M-2 sensor design is applicable for the integration of on-chip CMOS electronics for the Internet of Things.en_US
dc.language.isoen_USen_US
dc.titleLOW-COST TEMPERATURE-COMPENSATED THERMORESISTIVE MICRO CALORIMETRIC FLOW SENSOR BY USING 0.35 mu m CMOS MEMS TECHNOLOGYen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 IEEE 29TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)en_US
dc.citation.spage189en_US
dc.citation.epage192en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000381797300050en_US
dc.citation.woscount1en_US
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