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dc.contributor.authorIwai, Hiroshien_US
dc.date.accessioned2017-04-21T06:49:27Z-
dc.date.available2017-04-21T06:49:27Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-5090-2969-3en_US
dc.identifier.issn1930-8876en_US
dc.identifier.urihttp://hdl.handle.net/11536/136248-
dc.description.abstractThe progress of the electronics has been conducted by the downsizing of electron devices for more than 100 years since its beginning in early 20th century. However, it is believed now that the downsizing will reach its limit within a few to several years because of several sure reasons. After reaching the limit there is no Moore\'s law, and we cannot expect such a tremendous progress in cost, performance and energy consumption as we experienced in the past. Although the market for CMOS devices will still keep increasing for future, the technology development will spread to large spectrum of different devices, such as sensor, memory, power, photovoltaic, battery, MEMS devices which are demanded for the coming IoT environment, where everything is connected with internet. This will become a virtual extension of Moore\'s law, and will cause a big paradigm change in a system and society level. In a long term, however, the system fabricated on the solid-state devices and there network cannot compete with the existing bio system in efficiency, and the technology how to use the bio system, and combine the electron and bio system will become important.en_US
dc.language.isoen_USen_US
dc.subjectenden_US
dc.subjectlimiten_US
dc.subjectdownsizingen_US
dc.subjectelectron devicesen_US
dc.subjectscalingen_US
dc.subjectIoTen_US
dc.subjectbioen_US
dc.titleEnd of the downsizing and world after thaten_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 46TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC)en_US
dc.citation.spage121en_US
dc.citation.epage126en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000386655900029en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper