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dc.contributor.authorWu, Ming-Hungen_US
dc.contributor.authorLin, Horng-Chihen_US
dc.contributor.authorLi, Pei-Wenen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.date.accessioned2017-04-21T06:49:06Z-
dc.date.available2017-04-21T06:49:06Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-4673-8258-8en_US
dc.identifier.issn1946-1550en_US
dc.identifier.urihttp://hdl.handle.net/11536/136412-
dc.description.abstractIGZO transistors with various gate/drain-offset lengths (L-GDO) were fabricated with the film-profile-engineering method. Breakdown voltage (V-BD) of the fabricated devices increases while transconductance (gm) decreases with increasing LGDO. In contrast, threshold voltage and subthreshold swing remain relatively unchanged. VBD of similar to 80 V is obtained with LGDO of 0.3 mu m . Output characteristics with operation voltage up to 50 V are also demonstrated, evidencing the capability of the device for high-voltage operation. Impact of hot-carrier stress is also investigated in this work.en_US
dc.language.isoen_USen_US
dc.titleFilm-Profile-Engineered IGZO Thin-Film Transistors with Gate/Drain Offset for High Voltage Operationen_US
dc.typeProceedings Paperen_US
dc.identifier.journalProceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)en_US
dc.citation.spage272en_US
dc.citation.epage275en_US
dc.contributor.department電機學院zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000389243200064en_US
dc.citation.woscount0en_US
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