微波點對點傳輸設備熱傳分析

Abstract

由於無線網路通訊近年來隨著手機使用者增加，網路通訊設備產業近年來積極發展高性能、體積小、重量輕的產品外。而後端傳輸處理設備是使用多種網通IC，在IC運算過程中，會將能量以熱形態傳出，熱能堆積會造成IC壽命減短，而造成產品壽命不如預期，因此將熱有效傳遞至機殼可達到降低熱堆積。 研究微波點對點傳輸設備內熱傳結構分析，在封閉環境下將熱能使用傳遞方式導出並達到降低熱堆積，運用CFD模擬軟體來比較，並比較導熱材料與未使用導熱材料時兩者差異分析。

In recent years, owing to the popularity of wireless network communication technology following the increase in cellphone users, the network communications equipment industry has been actively developing high-performance, lightweight products in low volumes. A back-end transmission processing unit combines multiple types of network communication integrated circuit (IC) chips, which release energy in the form of heat during the computing process. Heat build-up can shorten the service life of IC chips, which in turn causes an unexpected reduction in product life span. As a countermeasure, heat should be effectively transferred to the phone case. The present study analyzed the internal heat transfer process of point-to-point microwave transmitters. Heat was transferred out of an enclosed environment to reduce heat build-up. A computational fluid dynamics simulator program was then used to compare the difference in the internal heat transfer process under the presence and absence of a thermal conductive material.