Full metadata record
DC FieldValueLanguage
dc.contributor.author劉承泓zh_TW
dc.contributor.author白田理一郎zh_TW
dc.contributor.authorLiu, Chen-Hungen_US
dc.contributor.authorRiichiro, Shirotaen_US
dc.date.accessioned2018-01-24T07:38:13Z-
dc.date.available2018-01-24T07:38:13Z-
dc.date.issued2016en_US
dc.identifier.urihttp://etd.lib.nctu.edu.tw/cdrfb3/record/nctu/#GT070150726en_US
dc.identifier.urihttp://hdl.handle.net/11536/139648-
dc.description.abstract本篇論文主要研究不同NO氮化濃度下NAND快閃記憶體元件抹寫週期的忍耐度(endurance)。採用三維元件模擬,來驗證量測特性。我們發現週期忍耐度後臨限電壓位移,轉導(Gm)回復 和次臨界擺幅 (SS) 上升等現象發生。本論文主要討論一種模型,淺溝槽絕緣(STI)內的正電荷及穿隧氧化層邊緣(edge of the tunnel oxide)的正電荷為最可能週期忍耐度後發生退化的主要原因。zh_TW
dc.description.abstractIn this thesis, we investigate endurance characteristic for 100 cycles with different NO nitridation in NAND FLASH memory device. After endurance, the Vt shift, Gm recovery and subthreshold swing (SS) degradation occurred. So, in this work, one possible model of degradation is investigated by examining the measurement data and found that the positive fixed charge in STI and in the edge of the tunnel oxide are the most reasonable to affect these degradations.en_US
dc.language.isoen_USen_US
dc.subject次臨界擺幅zh_TW
dc.subject轉導回復zh_TW
dc.subject淺溝槽絕緣zh_TW
dc.subject旋轉塗佈玻璃zh_TW
dc.subject週期忍耐度zh_TW
dc.subjectNO氮化製程zh_TW
dc.subjectsub-threshold swingen_US
dc.subjectgm recoveryen_US
dc.subjectSTIen_US
dc.subjectspin on glassen_US
dc.subjectfixed chargeen_US
dc.subjectinterface state densityen_US
dc.subjectenduranceen_US
dc.subjectNO nitridationen_US
dc.titleNAND 快閃記憶體在少量寫入/抹除操作下異常的次臨界擺幅及轉導回復zh_TW
dc.titleAnomalous subthreshold swing and transconductance recovery within early program erase cycling of the NAND flash memoryen_US
dc.typeThesisen_US
dc.contributor.department電機工程學系zh_TW
Appears in Collections:Thesis