陣列式晶圓級攝像模組系統設計應用於口腔內視鏡

Abstract

WLM(Wafer Level camera Module)具有尺寸小、耐高溫的特性，是可進行SMT高溫回流焊鍚爐的電子零部件，符合電子產品設計方案的布局簡單化要求，實現全自動化生產，節省製造成本，應用於手機、平板、車載、電視、醫療等皆有其特殊優勢。

本論文提出陣列式晶圓級攝像模組設計應用於口腔內視鏡系統，採用3顆WLM以3x1陣列方式排列用以捕捉圖像，通過影像擷取系統把圖像訊息傳送到PC上做處理。我們嘗試在WLM鏡頭處外加微結構稜鏡片，用它來增加約31.3%視野範圍(FOV60°→FOV78.8°)

WLM (Wafer Level camera Module) is a small size, high temperature resistant, can be SMT high-temperature reflow electronic component. WLM conforms to the simplicity requirement of electronic product design scheme and realizes full automatic production and saves manufacturing cost. It has special advantages in mobile phone, tablet, car, TV and medical treatment.

This thesis proposes a design of Array Wafer Level camera Module (WLM) applied on the manufacturing of Intraoral Camera system, which use 3 WLM arrange as a 3 x 1 array to capture image, than transfer it to PC through image capture system for further process. We added a micro prism sheet outside of WLM lens, and enhance 31.3% angle of view (FOV60°→FOV78.8°).