完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChang, Chih-Jongen_US
dc.contributor.authorChang, Chih-Haoen_US
dc.contributor.authorHwang, Jen-Dongen_US
dc.contributor.authorKuo, Cheng-Tzuen_US
dc.date.accessioned2014-12-08T15:19:50Z-
dc.date.available2014-12-08T15:19:50Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-4341-3en_US
dc.identifier.urihttp://hdl.handle.net/11536/14067-
dc.description.abstractDue to the development of high power density and high heat flux of IC and LED components and devices, the thermal management of microelectronics has become a very critical issue in 3C and opto-electronic industries. This has lead to the requirement of high thermal performance materials and thermal modules. To enhance the thermal performance of current thermal modules, it is very important to develop advanced thermal management materials to replace the conventional monolithic metals. In this study some kinds of graphites reinforced aluminum matrix composites were developed. The effects of reinforcement types and its volume fraction on thermal properties such as thermal conductivity as well as the thermal expansion coefficient were studied. Moreover, their thermal performance such as heat spreading resistance and thermal resistance compared to pure aluminum and copper were also conducted. From the results, it showed that the thermal conductivity of graphite/Al composites can reach to 500 similar to 600 W/m.K in X-Y plane and 40 similar to 100 W/m.K in cross plane with thermal expansion less than 10 ppm/K and density less than 2.5 g/cc; The spreading resistance of this composite is 2 similar to 5% lower than the one of pure copper, and 25 % lower than the one of pure aluminum.en_US
dc.language.isoen_USen_US
dc.subjectthermal managementen_US
dc.subjectgraphite/Al compositeen_US
dc.subjectheat spreading resistanceen_US
dc.titleTHERMAL CHARACTERIZATION OF HIGH THERMAL CONDUCTIVE GRAPHITES REINFORCED ALUMINUM MATRIX COMPOSITESen_US
dc.typeArticleen_US
dc.identifier.journalIMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCEen_US
dc.citation.spage405en_US
dc.citation.epage408en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000279097700105-
顯示於類別:會議論文