即時3D NURBS曲線插值應用於選擇性雷射燒結奈米銀粒子墨水

Abstract

本論文結合選擇性雷射燒結與即時3D NURBS曲線插值器，利用奈米銀粒子在特定波長下有較佳的吸收率，選用532 nm的雷射系統，探討如何對所塗佈於軟性基板上的奈米銀進行燒結，並透過NURBS曲線插值器取代直線近似曲線的方式作為雷射燒結曲線用的軌跡，避免因直線逼近曲線的過程中速度變化過大導致局部熱累積而破壞軟性基板，帶來不佳的燒結結果。 為了測試適當的雷射參數，分別針對雷射功率為300 mW到1000 mW，對應雷射掃描速度為100 mm/min到600 mm/min下的奈米銀粒子燒結，驗證經過燒結後，片電阻值最佳可從670 mΩ/□下降至209 mΩ/□。再結合3D NURBS曲線插值器做為雷射燒結軌跡使用，提升燒結後的奈米銀導電性，並實現這個概念於三維中，最後以一空間中螺旋曲線作為展示。

In this paper, we combine selective laser sintering with real-time 3D NURBS curve interpolator. Using the characteristic of silver nanoparticle has a great absorption rate at a specific wavelength. Choosing the 532 nm laser system to explore how to sintering the silver nanoparticle that coating on the flexible substrate. Utilizing the NURBS curve interpolator to replace the linear approximation curve as the laser sin-tering path. To avoid the linear approximation curve cause the speed change greatly and lead to destroy flexible substrate by local heat accumulation. It will bring the poor sintering result. Aim the laser power from 300 mW to 1000 mW and the laser scanning speed from 100 mm/min to 600 mm/min respectively to test the appropriate laser parameters for silver nanoparticle sintering. Verify after sintering, the optimum sheet resistance can reduce from 670 mΩ/□ to 209 mΩ/□. Then combine the 3D NURBS curve interpolator as the laser sintering path to enhance the conductivity of silver nanoparti-cle after sintering and implement this concept in 3D. Finally, a spatial spiral curve is demonstrated.