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dc.contributor.authorLin, CFen_US
dc.contributor.authorCheng, HCen_US
dc.contributor.authorFeng, MSen_US
dc.contributor.authorChi, GCen_US
dc.date.accessioned2014-12-08T15:01:15Z-
dc.date.available2014-12-08T15:01:15Z-
dc.date.issued1997-12-18en_US
dc.identifier.issn0921-5107en_US
dc.identifier.urihttp://hdl.handle.net/11536/141-
dc.description.abstractHigh quality GaN epitaxial layers were obtained with AlxGa1-xN buffer layers on 6H-SiC substrates. The low-pressure metalorganic chemical vapor deposition (LP-MOCVD) method was used. The 500 Angstrom thick buffer layers of AlxGa1-xN (0 less than or equal to x less than or equal to 1) were deposited on SiC substrates at 1025 degrees C. The FWHM of GaN (0004) X-ray curves are 2-3 arcmin, which vary with the Al content in AlxGa1-xN buffer layers. An optimum Al content is found to be 0.18. The best GaN epitaxial film has the mobility and carrier concentration about 564 cm(2) V-1 s(-1) and 1.6 x 10(17) cm(-3) at 300 K. The splitting diffraction angle between GaN and AlxGa1-xN were also analyzed from X-ray diffraction curves. (C) 1997 Elsevier Science S.A.en_US
dc.language.isoen_USen_US
dc.subjectGaNen_US
dc.subjectepitaxial layersen_US
dc.subjectAlxGa1-xN buffer layersen_US
dc.subject6H-SiC substratesen_US
dc.titleCharacterization of GaN epitaxial layers on SiC substrates with AlxGa1-xN buffer layersen_US
dc.typeArticleen_US
dc.identifier.journalMATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGYen_US
dc.citation.volume50en_US
dc.citation.issue1-3en_US
dc.citation.spage25en_US
dc.citation.epage28en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000071974800007-
dc.citation.woscount3-
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