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dc.contributor.authorHsu, Hsing-Huien_US
dc.contributor.authorLiu, Ta-Weien_US
dc.contributor.authorLin, Chuan-Dingen_US
dc.contributor.authorChia Kuo-Jungen_US
dc.contributor.authorHuang, Tiao-Yuanen_US
dc.contributor.authorLin, Horng-Chihen_US
dc.date.accessioned2014-12-08T15:20:10Z-
dc.date.available2014-12-08T15:20:10Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-2784-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/14311-
dc.description.abstractSi nanowire (NW) SONOS devices have recently been demonstrated as a good candidate for high-density non-volatile memory application [ 1][2]. Owing to the high surface-to-volume ratio of the NW channel, the programming and erasing (P/E) operation of the device could be performed at a lower voltage and much faster speed over the planar counterpart [2]. However, the fabrication of NW devices typically requires advanced lithographic tools and or complicated process flow. These are not compatible with the manufacturing of flat-panel products where the device feature size is generally several microns or larger. In this work, we propose a simple and cost-effective approach to integrate planar poly-Si thin-film transistors (TFTs) and tri-gated poly-Si NW SONOS devices without resorting to advanced lithographic tools. Greatly enhanced P/E speed with the use of NW structure is clearly demonstrated.en_US
dc.language.isoen_USen_US
dc.titleTri-gated Poly-Si Nanowire SONOS Devicesen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF TECHNICAL PROGRAM: 2009 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONSen_US
dc.citation.spage148en_US
dc.citation.epage149en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000272451000066-
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