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dc.contributor.authorChen, Te-Chihen_US
dc.contributor.authorKuo, Yueen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorChen, Min-Chenen_US
dc.contributor.authorChen, Hua-Maoen_US
dc.date.accessioned2018-08-21T05:52:38Z-
dc.date.available2018-08-21T05:52:38Z-
dc.date.issued2017-10-25en_US
dc.identifier.issn0022-3727en_US
dc.identifier.urihttp://dx.doi.org/10.1088/1361-6463/aa864cen_US
dc.identifier.urihttp://hdl.handle.net/11536/143845-
dc.description.abstractDevice characteristics changes in an a-IGZO thin film transistor under light illumination and at raised temperature have been investigated. Light exposure causes a large leakage current, which is more obvious with an increase in the illumination energy, power and the temperature. The increase in the leakage current is due to the trap assisted photon excitation process that generates electron-hole pairs and the mechanism is enhanced with the additional thermal energy. The leakage current comes from the source side because holes generated in the process drift to the source side and therefore lower the barrier height. The above mechanism has been further verified with experiments of drain bias induced shifts in the threshold voltage and the subthreshold slope.en_US
dc.language.isoen_USen_US
dc.subjectamorphous indium gallium zinc oxideen_US
dc.subjectthin film transistoren_US
dc.subjectdevice deteriorationen_US
dc.titleMechanism of a-IGZO TFT device deterioration-illumination light wavelength and substrate temperature effectsen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/1361-6463/aa864cen_US
dc.identifier.journalJOURNAL OF PHYSICS D-APPLIED PHYSICSen_US
dc.citation.volume50en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000411891500002en_US
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