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dc.contributor.authorJheng, Li Sianen_US
dc.contributor.authorLi, Huien_US
dc.contributor.authorChang, Chiaoen_US
dc.contributor.authorCheng, Hung Hsiangen_US
dc.contributor.authorLi, Liang Chenen_US
dc.date.accessioned2019-04-03T06:42:01Z-
dc.date.available2019-04-03T06:42:01Z-
dc.date.issued2017-09-01en_US
dc.identifier.issn2158-3226en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4997348en_US
dc.identifier.urihttp://hdl.handle.net/11536/143858-
dc.description.abstractWe report an investigation of the Schottky barrier height (SBH) of Ni/n-type Ge and Ni/n-type GeSn films that is annealed at a wide range of temperatures. Both voltage-and temperature-dependent current-voltage (I-V) measurements are performed. From the analysis of these nonlinear I-V traces, the SBH is found and the results shows that the SBH of Ni/n-type GeSn (a) is smaller than that of Ni/n-type Ge and (b) decreases with the Sn content of the surface GeSn layer associated with the thermal annealing. By modeling the composition-and strain-dependent energy bandgap (E-g), the relationship between the SBH and Eg is established and it is found that SBH/E-g similar to 0.8. These results suggest that the GeSn film could serve as an interfacial layer for the reduction of the SBH in Ge-based electronic devices that are desirable for applications. (C) 2017 Author(s).en_US
dc.language.isoen_USen_US
dc.titleComparative investigation of Schottky barrier height of Ni/n-type Ge and Ni/n-type GeSnen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4997348en_US
dc.identifier.journalAIP ADVANCESen_US
dc.citation.volume7en_US
dc.citation.issue9en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department奈米科技中心zh_TW
dc.contributor.departmentCenter for Nanoscience and Technologyen_US
dc.identifier.wosnumberWOS:000412070600097en_US
dc.citation.woscount0en_US
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