完整後設資料紀錄
DC 欄位語言
dc.contributor.authorWang, Huan-Chungen_US
dc.contributor.authorSu, Huan-Fuen_US
dc.contributor.authorLuc, Quang-Hoen_US
dc.contributor.authorLee, Ching-Tingen_US
dc.contributor.authorHsu, Heng-Tungen_US
dc.contributor.authorChang, Edward Yien_US
dc.date.accessioned2018-08-21T05:53:05Z-
dc.date.available2018-08-21T05:53:05Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn2162-8769en_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0251711jssen_US
dc.identifier.urihttp://hdl.handle.net/11536/144256-
dc.description.abstractAn effective method of improving the linearity of AlGaN/GaN HEMTs by using dual-gate technology is demonstrated. In this letter, we compare the DC characteristics and device linearity of the dual-gate AlGaN/GaN HEMTs with conventional single-gate AlGaN/GaN HEMTs. The correlation between the extrinsic transconductance (Gm) with third-order intermodulation distortion (IM3) and third order intercept point (IP3) suggests that the broader Gm distribution as a function of gate-bias, causes a lower IM3 level and higher IP3 values for the device. The improved device linearity demonstrates that dual-gate AlGaN/GaN HEMT design is a good approach for high-linearity RF device applications. (c) The Author(s) 2017. Published by ECS. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleImproved Linearity in AlGaN/GaN HEMTs for Millimeter-Wave Applications by Using Dual-Gate Fabricationen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/2.0251711jssen_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.citation.volume6en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department國際半導體學院zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInternational College of Semiconductor Technologyen_US
dc.identifier.wosnumberWOS:000418369500027en_US
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