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dc.contributor.authorShih, Cheng Weien_US
dc.contributor.authorChin, Alberten_US
dc.contributor.authorLu, Chun Fuen_US
dc.contributor.authorSu, Wei Fangen_US
dc.date.accessioned2018-08-21T05:53:11Z-
dc.date.available2018-08-21T05:53:11Z-
dc.date.issued2018-01-17en_US
dc.identifier.issn2045-2322en_US
dc.identifier.urihttp://dx.doi.org/10.1038/s41598-017-17066-xen_US
dc.identifier.urihttp://hdl.handle.net/11536/144373-
dc.description.abstractHigh performance p-type thin-film transistor (p-TFT) was realized by a simple process of reactive sputtering from a tin (Sn) target under oxygen ambient, where remarkably high field-effect mobility (mu(FE)) of 7.6 cm(2)/Vs, 140 mV/dec subthreshold slope, and 3 x 10(4) on-current/off-current were measured. In sharp contrast, the SnO formed by direct sputtering from a SnO target showed much degraded mu(FE), because of the limited low process temperature of SnO and sputtering damage. From the first principle quantum-mechanical calculation, the high hole mu(FE) of SnO p-TFT is due to its considerably unique merit of the small effective mass and single hole band without the heavy hole band. The high performance p-TFTs are the enabling technology for future ultra-low-power complementary-logic circuits on display and three-dimensional brain-mimicking integrated circuits.en_US
dc.language.isoen_USen_US
dc.titleRemarkably High Hole Mobility Metal-Oxide Thin-Film Transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1038/s41598-017-17066-xen_US
dc.identifier.journalSCIENTIFIC REPORTSen_US
dc.citation.volume8en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000422716900023en_US
Appears in Collections:Articles