標題: A Single Layer 3-D Touch Sensing System for Mobile Devices Application
作者: Du, Li
Liu, Chun-Chen
Zhang, Yan
Li, Yilei
Du, Yuan
Kuan, Yen-Cheng
Chang, Mau-Chung Frank
交大名義發表
National Chiao Tung University
關鍵字: 3-D;bootstrapping;correlated double sampling (CDS);finger position;gesture recognition;human machine interaction;interchannel coupling;mobile device;touchscreen
公開日期: 1-二月-2018
摘要: Touch sensing has been widely implemented as a main methodology to bridge human and machine interactions. The traditional touch sensing range is 2-D and therefore limits the user experience. To overcome these limitations, we propose a novel 3-D contactless touch sensing called Airtouch system, which improves user experience by remotely detecting single/multi-finger position. A single layer touch panel with triangle-shaped electrodes is proposed to achieve multitouch detection capability as well as manufacturing cost reduction. Moreover, an oscillator-based-capacitive touch sensing circuit is implemented as the sensing hardware with the bootstrapping technique to eliminate the interchannel coupling effects. To further improve the system accuracy, a grouping algorithm is proposed to group the useful channels' data and filter out hardware noise impact. Finally, improved algorithms are proposed to eliminate the fringing capacitance effect and achieve accurate finger position estimation. EM simulation proved that the proposed algorithm reduced the maximum systematic error by 11 dB in the horizontal position detection. The proposed system consumes 2.3 mW and is fully compatible with existing mobile device environments. A prototype is built to demonstrate that the system can successfully detect finger movement in a vertical direction up to 6 cm and achieve a horizontal resolution up to 0.6 cm at 1 cm finger-height. As a new interface for human and machine interactions, this system offers great potential in finger movement detection and gesture recognition for small-sized electronics and advanced human interactive games for mobile device.
URI: http://dx.doi.org/10.1109/TCAD.2017.2702630
http://hdl.handle.net/11536/144395
ISSN: 0278-0070
DOI: 10.1109/TCAD.2017.2702630
期刊: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
Volume: 37
起始頁: 286
結束頁: 296
顯示於類別:期刊論文