完整後設資料紀錄
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dc.contributor.authorChen, Tsung-Hanen_US
dc.contributor.authorLin, Ping-Yuen_US
dc.contributor.authorChang, Hsiu-Chengen_US
dc.contributor.authorChen, Chun-Huaen_US
dc.date.accessioned2018-08-21T05:53:15Z-
dc.date.available2018-08-21T05:53:15Z-
dc.date.issued2017-03-07en_US
dc.identifier.issn2040-3364en_US
dc.identifier.urihttp://dx.doi.org/10.1039/c7nr00132ken_US
dc.identifier.urihttp://hdl.handle.net/11536/144464-
dc.description.abstractWe describe an innovative interfacial design concept and nanostructuring of novel BixSb2-xTe3 (BST) nanoassembled films comprising unique air-solid interfaces from micro-scaled open gaps to isolated sealed mesopores, and high-quality solid-solid ones including the coherent grain boundaries and specific twins, utilizing pulsed laser deposition (PLD), for potentially activating multiple thermoelectric enhancing mechanisms. The unusual mesopore embedded BST films exhibit the highest power factor of similar to 33 mu W cm(-1) K-2, which is comparable to or higher than the previously reported values for BST, and the corresponding relatively low thermal diffusivity in contrast to that for dense pore-less BST films evidently reveals the crucial role of the three-dimensionally and densely arranged air-solid interfaces in significantly arising the phonon scattering.en_US
dc.language.isoen_USen_US
dc.titleEnhanced thermoelectricity of three-dimensionally mesostructured BixSb2-xTe3 nanoassemblies: from micro-scaled open gaps to isolated sealed mesoporesen_US
dc.typeArticleen_US
dc.identifier.doi10.1039/c7nr00132ken_US
dc.identifier.journalNANOSCALEen_US
dc.citation.volume9en_US
dc.citation.spage3283en_US
dc.citation.epage3292en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000396044400040en_US
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