完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChou, Chen-Hanen_US
dc.contributor.authorLu, Yu-Hongen_US
dc.contributor.authorTsai, Yi-Heen_US
dc.contributor.authorShih, An-Shihen_US
dc.contributor.authorYeh, Wen-Kuanen_US
dc.contributor.authorChien, Chao-Hsinen_US
dc.date.accessioned2018-08-21T05:53:19Z-
dc.date.available2018-08-21T05:53:19Z-
dc.date.issued2018-01-01en_US
dc.identifier.issn2162-8769en_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0161802jssen_US
dc.identifier.urihttp://hdl.handle.net/11536/144535-
dc.description.abstractIn this study, we employed the electrical and material properties of various interfacial layers (ILs) such as GeO and YGeO on a Ge substrate. First, capacitors using various ILs with HfO2-based gate stacks were developed. The capacitor using YGeO IL exhibited a low interface state density (D-it) of 2.5 x 10(11) eV(-1)cm(-2) and an equivalent oxide thickness of 1.8 nm. Next, a reliability test for constant voltage stress was conducted for further studying the YGeO ILs. The capacitors with YGeO ILs presented higher immunity for Dit degradation. Further, to understand the material properties of various ILs, a simple experiment on capping a Si chip on GeO or YGeO/Ge samples through high-temperature annealing was conducted. We observed that Ge and GeO vapors can be absorbed by Si and detected through X-ray photoelectron spectroscopy (XPS). XPS spectra of Si chips capped on GeO IL presented obvious features of Ge and GeO through annealing at 500 degrees C; however, the XPS spectra of Si chips capped on YGeO IL presented no features, indicating that YGeO ILs had higher thermal stability than GeO ILs. To further analyze the HfO2-based gate stacks with various ILs, Ge diffusion into a high-k HfO2 layer was investigated through angle-resolved XPS. We observed that YGeO ILs with HfO2-based gate stacks can reduce Ge diffusion into a HfO2 layer. (C) 2018 The Electrochemical Society.en_US
dc.language.isoen_USen_US
dc.titleIncorporating Yttrium into a GeO Interfacial Layer with HfO2-Based Gate Stack on Geen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/2.0161802jssen_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.citation.volume7en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000425215200003en_US
顯示於類別:期刊論文