Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yu, Ting-Yang | en_US |
dc.contributor.author | Liang, Hag-Wen | en_US |
dc.contributor.author | Chang, Yao-Jen | en_US |
dc.contributor.author | Chen, Kuan-Neng | en_US |
dc.date.accessioned | 2018-08-21T05:53:22Z | - |
dc.date.available | 2018-08-21T05:53:22Z | - |
dc.date.issued | 2018-08-01 | en_US |
dc.identifier.issn | 1533-4880 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1166/jnn.2018.15375 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/144594 | - |
dc.description.abstract | Asymmetric Cu to In/Sn bonding structure with Ni ultrathin buffer layer (UBL) on Cu side is investigated in this research. The usage of Ni UBL slows down intermetallic compound (IMC) formation during bonding. Asymmetric structure can separate electrical isolation and solder process to avoid interaction, which can prevent IMC formation during polymer curing. A well-bonded asymmetric structure can be achieved with submicron solder by 150 degrees C bonding for 15 min. The structure shows the potential for low temperature hybrid bonding technology in high-density three-dimensional (3D) integration. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | 3D Integration | en_US |
dc.subject | 3D Integrated Circuit (3D-IC) | en_US |
dc.subject | Asymmetric Bonding | en_US |
dc.subject | Hybrid Bonding | en_US |
dc.subject | Interconnect | en_US |
dc.subject | Micro Bump | en_US |
dc.title | Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-Thin Buffer Layer | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1166/jnn.2018.15375 | en_US |
dc.identifier.journal | JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | en_US |
dc.citation.volume | 18 | en_US |
dc.citation.spage | 5397 | en_US |
dc.citation.epage | 5403 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000426059800025 | en_US |
Appears in Collections: | Articles |