完整後設資料紀錄
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dc.contributor.authorLiao, Chien-Huien_US
dc.contributor.authorWen, Charles Hung-Pinen_US
dc.date.accessioned2018-08-21T05:53:23Z-
dc.date.available2018-08-21T05:53:23Z-
dc.date.issued2018-03-01en_US
dc.identifier.issn1751-8601en_US
dc.identifier.urihttp://dx.doi.org/10.1049/iet-cdt.2017.0014en_US
dc.identifier.urihttp://hdl.handle.net/11536/144630-
dc.description.abstractHotspots occur frequently in three-dimensional (3D) multi-core processors (3D-MCPs), and they may adversely impact both the reliability and lifetime of a system. The authors present dynamic-voltage-assignment (DVA) strategies that reduce hotspots in and optimise the performance of 3D-MCPs by pre-emptively selecting voltages among low-power and high-performance operating modes. The proposed DVA strategies can be employed in online, thermally constrained task schedulers. Three DVA strategies, random DVA, thermal-aware DVA (TADVA) and TADVA2.0, are proposed to reduce the temperature increase in 3D-MCPs by pre-emptively and dynamically estimating the optimum VAs for all cores in the processor during runtime once the chip begins operating. In particular, TADVA2.0 uses the temperature-variation rates of the cores and takes into account two important thermal behaviours of 3D-MCPs that can effectively limit the temperature increase in 3D-MCPs. Experimental results indicate that, when compared with two previous online thermally constrained task schedulers, the proposed task scheduler with their novel DVA strategy can reduce hotspot occurrences by approximate to 60% and improve throughput by approximate to 8%. These results indicate that the proposed TADVA2.0 strategy is an effective technique for suppressing hotspot occurrences and optimising throughput for 3D-MCPs subject to thermal constraints.en_US
dc.language.isoen_USen_US
dc.subjectmultiprocessing systemsen_US
dc.subjectprocessor schedulingen_US
dc.subjectpower aware computingen_US
dc.subjectthermal behavioursen_US
dc.subjecttemperature-variation ratesen_US
dc.subjectTADVA2.0en_US
dc.subjectthermal-aware DVAen_US
dc.subjectrandom DVAen_US
dc.subjectthermally constrained task schedulersen_US
dc.subjecthigh-performance operating modesen_US
dc.subjectDVA strategiesen_US
dc.subjectdynamic-voltage-assignmenten_US
dc.subject3D multicore processorsen_US
dc.subject3D-MCPen_US
dc.subjectonline task scheduleren_US
dc.titleOnline task scheduler in 3D-MCPs with TADVAen_US
dc.typeArticleen_US
dc.identifier.doi10.1049/iet-cdt.2017.0014en_US
dc.identifier.journalIET COMPUTERS AND DIGITAL TECHNIQUESen_US
dc.citation.volume12en_US
dc.citation.spage44en_US
dc.citation.epage52en_US
dc.contributor.department資訊工程學系zh_TW
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentDepartment of Computer Scienceen_US
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000426623000002en_US
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