完整後設資料紀錄
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dc.contributor.authorLee, Ming Lingen_US
dc.contributor.authorWang, Jer Chyien_US
dc.contributor.authorKao, Chyuan Hauren_US
dc.contributor.authorChen, Hsiangen_US
dc.contributor.authorLin, Chan Yuen_US
dc.contributor.authorChang, Che Weien_US
dc.contributor.authorMahanty, Rama Krushnaen_US
dc.contributor.authorLin, Chun Fuen_US
dc.contributor.authorChang, Kow Mingen_US
dc.date.accessioned2018-08-21T05:53:25Z-
dc.date.available2018-08-21T05:53:25Z-
dc.date.issued2018-04-15en_US
dc.identifier.issn0272-8842en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.ceramint.2017.12.239en_US
dc.identifier.urihttp://hdl.handle.net/11536/144665-
dc.description.abstractIn this paper, we demonstrate electrolyte-insulator-semiconductor devices for biochemical sensing applications prepared from ZnO and Ti-doped ZnO sensing membranes deposited on Si substrates by radio frequency sputtering. The structural, morphological, and compositional features of these deposited films with multitemperature annealing were studied using X-ray diffraction, atomic force microscopy, and X-ray photoelectron spectroscopy, respectively. Sensitivity, linearity, hysteresis, and drift rate were measured to determine the sensing and reliability performance of all fabricated devices. Compared to the ZnO electrolyte-insulator-semiconductor (EIS), the Ti-doped ZnO EIS sensor annealed at 700 degrees C exhibits a higher sensitivity of 57.56 mV/pH, lower hysteresis of 2.79 mV, and lower drift rate of 0.29 mV/h. For Ti-doped ZnO, sensitivities of 3.62 mV/mM and 6.42 mV/mM were obtained for urea and glucose sensing, respectively. The improvements are owing to Ti-doping, which produces a rougher sensing surface, a well-crystallized grain structure, and thinner silicate and SiO2 at the silicon-oxide interface.en_US
dc.language.isoen_USen_US
dc.subjectZnOen_US
dc.subjectTi dopeden_US
dc.subjectRTAen_US
dc.subjectBiosensingen_US
dc.subjectUreaen_US
dc.titleComparison of ZnO and Ti-doped ZnO sensing membrane applied in electrolyte-insulator-semiconductor structureen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.ceramint.2017.12.239en_US
dc.identifier.journalCERAMICS INTERNATIONALen_US
dc.citation.volume44en_US
dc.citation.spage6081en_US
dc.citation.epage6088en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000427215100037en_US
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