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dc.contributor.authorSingh, Ranjodhen_US
dc.contributor.authorLin, Yen-Tingen_US
dc.contributor.authorKo, Fu-Hsiangen_US
dc.date.accessioned2018-08-21T05:53:26Z-
dc.date.available2018-08-21T05:53:26Z-
dc.date.issued2018-03-01en_US
dc.identifier.issn1438-7492en_US
dc.identifier.urihttp://dx.doi.org/10.1002/mame.201700468en_US
dc.identifier.urihttp://hdl.handle.net/11536/144682-
dc.description.abstractThe hydrophilic character of chitosan (CS) limits its use as a gate dielectric material in thin-film transistors (TFTs) based on aqueous solution-processable semiconductor materials. In this study, this drawback is overcome through controlled crosslinking of CS and report, for the first time, its application to aqueous solution-processable TFTs. In comparison to natural CS thin films, crosslinked chitosan (Cr-CS) thin films are hydrophobic. The dielectric properties of Cr-CS thin films are explored through fabrication of metal-insulator-metal devices on a flexible substrate. Compared to natural CS, the Cr-CS dielectric thin films show enhanced environmental and water stabilities, with a high breakdown voltage (10 V) and low leakage current (0.02 nA). The compatibility of Cr-CS dielectric thin films with aqueous solution-processable semiconductors is demonstrated by growing ZnO nanorods via a hydrothermal method to fabricate flexible TFT devices. The ZnO nanorod-based TFTs show a high field-effect mobility (linear regime) of 10.48 cm(2) V-1 s(-1). Low temperature processing conditions (below 100 degrees C) and water as the solvent are utilized to ensure the process is environmental friendly to address the e-waste problem.en_US
dc.language.isoen_USen_US
dc.subjectbiomaterialen_US
dc.subjectcrosslinking of chitosanen_US
dc.subjectflexibleen_US
dc.subjecttransistoren_US
dc.subjectZnO nanorodsen_US
dc.titleAqueous Solution-Processable, Flexible Thin-Film Transistors Based on Crosslinked Chitosan Dielectric Thin Filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/mame.201700468en_US
dc.identifier.journalMACROMOLECULAR MATERIALS AND ENGINEERINGen_US
dc.citation.volume303en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000427483300006en_US
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