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dc.contributor.authorFu, Ruofanen_US
dc.contributor.authorYang, Jianwenen_US
dc.contributor.authorChang, Wei-Chiaoen_US
dc.contributor.authorChang, Wei-Chengen_US
dc.contributor.authorChang, Chien-Minen_US
dc.contributor.authorLin, Dongen_US
dc.contributor.authorZhang, Qunen_US
dc.contributor.authorLiu, Po-Tsunen_US
dc.contributor.authorShieh, Han-Ping D.en_US
dc.date.accessioned2018-08-21T05:53:28Z-
dc.date.available2018-08-21T05:53:28Z-
dc.date.issued2018-03-21en_US
dc.identifier.issn1862-6300en_US
dc.identifier.urihttp://dx.doi.org/10.1002/pssa.201700785en_US
dc.identifier.urihttp://hdl.handle.net/11536/144729-
dc.description.abstractIn this paper, the influence of annealing temperature on amorphous indium-zinc-tungsten-oxide (a-IZWO) thin-film transistors (TFTs) is investigated. As the annealing temperature increases, the IZWO films maintain an amorphous state, which is conducive to the uniformity of the TFT. The field effect mobility of the device increases as a function of annealing temperature and reaches 16.2cm(2)V(-1)s(-1) at 300 degrees C, along with an on/off current ratio of 1.6x10(8). Meanwhile, the corresponding positive bias stability is improved, as confirmed by the fact that the threshold voltage shift value reduces to 0.4V after being stressed for 1500s. This result can be ascribed to the decrease in electrons captured by the deep defects in a-IZWO TFTs.en_US
dc.language.isoen_USen_US
dc.subjectannealingen_US
dc.subjectindium-zinc-tungsten-oxideen_US
dc.subjectpositive bias stressen_US
dc.subjectthin-film transistorsen_US
dc.titleThe Influence of Annealing Temperature on Amorphous Indium-Zinc-Tungsten Oxide Thin-Film Transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/pssa.201700785en_US
dc.identifier.journalPHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCEen_US
dc.citation.volume215en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000428341000012en_US
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