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dc.contributor.authorLiu, Jen-Chiehen_US
dc.contributor.authorWu, Tzu-Yunen_US
dc.contributor.authorHou, Tuo-Hungen_US
dc.date.accessioned2018-08-21T05:53:37Z-
dc.date.available2018-08-21T05:53:37Z-
dc.date.issued2018-05-01en_US
dc.identifier.issn1549-7747en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCSII.2018.2821268en_US
dc.identifier.urihttp://hdl.handle.net/11536/144937-
dc.description.abstractA device-circuit co-design strategy of incremental step pulse programming (ISPP) tailored specifically for resistive-switching random access memory (RRAM) is elaborated using HfO2 RRAM as an example. The proposed strategy optimizes ISPP by considering programming energy, speed, peripheral circuit design, and device lifetime simultaneously. Interplay between ISPP configuration and device switching behavior is comprehensively clarified, and the result provides useful indicators for estimating peripheral circuit overhead and programming performance. Overstress effects affect both switching voltages and endurance lifetime substantially and, thus, should be carefully minimized.en_US
dc.language.isoen_USen_US
dc.subjectRRAMen_US
dc.subjectISPPen_US
dc.subjectdevice-circuit co-designen_US
dc.subjectover stressen_US
dc.titleOptimizing Incremental Step Pulse Programming for RRAM Through Device-Circuit Co-Designen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCSII.2018.2821268en_US
dc.identifier.journalIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFSen_US
dc.citation.volume65en_US
dc.citation.spage617en_US
dc.citation.epage621en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000431451700019en_US
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