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dc.contributor.authorLiao, Chien-Huien_US
dc.contributor.authorWen, Charles H. -P.en_US
dc.date.accessioned2018-08-21T05:53:42Z-
dc.date.available2018-08-21T05:53:42Z-
dc.date.issued2018-06-01en_US
dc.identifier.issn1943-0663en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LES.2017.2776292en_US
dc.identifier.urihttp://hdl.handle.net/11536/145041-
dc.description.abstractHotspots occur frequently in 3-Dmulticore processors (3D-MCPs) and they may adversely impact the reliability of the system and its lifetime. We present support-vector-machine (SVM)-based dynamic voltage assignment (SVMDVA) strategy to select voltages among low-power and high-performance operating modes for reducing hotspots and optimizing performance in 3D-MCPs. The proposed SVMDVA can be employed in online, thermally constrained task schedulers. First, we revealed two different thermal regions of 3D-MCPs and extract different key features of these regions. Based on these key features, SVM models are constructed to predict the thermal behavior and the best operation mode of 3D-MCPs during runtime. SVMDVA using SVM models with monitoring workload and temperature behavior can effectively limit the temperature increase in 3D-MCPs. This is extremely important for accurately predicting the thermal behavior and providing the optimum operating condition of 3D-MCPs to achieve the best system performance. Experimental results show that SVMDVA is an effective technique for reducing hotspot occurrences (57.19%) and increasing throughput (25.41%) for 3D-MCPs.en_US
dc.language.isoen_USen_US
dc.subject3-D multicore processors (3D-MCPs)en_US
dc.subjectdynamic voltage and frequency scaling (DVFS)en_US
dc.subjecthotspotsen_US
dc.subjectonline task scheduleren_US
dc.subjectsupport vector machine (SVM)en_US
dc.subjectvoltage assignmenten_US
dc.titleSVM-Based Dynamic Voltage Prediction for Online Thermally Constrained Task Scheduling in 3-D Multicore Processorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LES.2017.2776292en_US
dc.identifier.journalIEEE EMBEDDED SYSTEMS LETTERSen_US
dc.citation.volume10en_US
dc.citation.spage49en_US
dc.citation.epage52en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000433336000005en_US
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