統計資料
總造訪次數
| 檢視 | |
|---|---|
| Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration | 112 |
本月總瀏覽
| 六月 2025 | 七月 2025 | 八月 2025 | 九月 2025 | 十月 2025 | 十一月 2025 | 十二月 2025 | |
|---|---|---|---|---|---|---|---|
| Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration | 0 | 0 | 0 | 0 | 1 | 0 | 0 |
檔案下載
| 檢視 | |
|---|---|
| 000288404200067.pdf | 10 |
國家瀏覽排行
| 檢視 | |
|---|---|
| 中國 | 95 |
| 美國 | 9 |
| 法國 | 2 |
| 俄羅斯聯邦 | 2 |
| 巴西 | 1 |
| 波蘭 | 1 |
縣市瀏覽排行
| 檢視 | |
|---|---|
| Shenzhen | 95 |
| Menlo Park | 4 |
| Edmond | 2 |
| Kensington | 2 |
| Paris | 2 |
| Saint Petersburg | 2 |
| São Paulo | 1 |
| University Park | 1 |
| Wroclaw | 1 |