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dc.contributor.authorHsieh, E. R.en_US
dc.contributor.authorChung, Steve S.en_US
dc.contributor.authorTsai, C. H.en_US
dc.contributor.authorHuang, R. M.en_US
dc.contributor.authorTsai, C. T.en_US
dc.contributor.authorLiang, C. W.en_US
dc.date.accessioned2014-12-08T15:20:29Z-
dc.date.available2014-12-08T15:20:29Z-
dc.date.issued2011en_US
dc.identifier.isbn978-1-4244-9111-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/14585-
dc.description.abstractA new effect, called random trap fluctuation(RTF), is proposed to study the impact of hot carrier stress on the device variability. It was found that not only the popular random dopant fluctuation (RDF), but also the traps, caused by the HC stress or FN-stress, induce the V(th) variation. After the FN stress, it was found that Vth variation is worse in pMOSFETs due to stress-induced interface traps. While, under the HC stress, different Vth variations were found for nMOSFETs and pMOSFETs. The Vth variation is enhanced in pMOSFETs due to RTF and reduced in nMOSFET as a result of the Trap Blocking Effect (TBE). RTF in pMOSFET might be the dominant factor of CMOS reliability for future generations.en_US
dc.language.isoen_USen_US
dc.subjecthot carrier effecten_US
dc.subjectrandom dopant fluctuationen_US
dc.subjectrandom trap fluctuationen_US
dc.titleNew Observations on the Physical Mechanism of Vth-Variation in Nanoscale CMOS Devices After Long Term Stressen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000295322100168-
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