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dc.contributor.authorLumbantoruan, Franky J.en_US
dc.contributor.authorWong, Yuen-Yeeen_US
dc.contributor.authorHuang, Wei-Chingen_US
dc.contributor.authorYu, Hung-Weien_US
dc.contributor.authorChang, Edward-Yien_US
dc.date.accessioned2018-08-21T05:54:28Z-
dc.date.available2018-08-21T05:54:28Z-
dc.date.issued2017-10-01en_US
dc.identifier.issn0361-5235en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s11664-017-5550-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/146004-
dc.description.abstractNH3 flow rate during AlGaN barrier layer growth not only affects the growth efficiency and surface morphology as a result of parasitic reactions but also influences the concentration of carbon impurity in the AlGaN barrier. Carbon, which decomposes from metal precursors, plays a role in electron compensation for AlGaN/GaN HEMT. No 2-dimensional electron gas (2-DEG) was detected in the AlGaN/GaN structure if grown with 0.5 slm of NH3 due to the presence of higher carbon impurity (2.6 x 10(19) cm(-2)). When the NH3 flow rate increased to 6.0 slm, the carbon impurity reduced to 2.10 x 10(18) atom cm(-3) and the 2 DEG electron density recovered to 9.57 x 10(12) cm(-2).en_US
dc.language.isoen_USen_US
dc.subjectAlGaN/GaN HEMTen_US
dc.subjectAlGaN barrier layeren_US
dc.subjectNH3 flowen_US
dc.subjectcarbonen_US
dc.subjectdonor compensationen_US
dc.subject2 DEG propertiesen_US
dc.titleEffects of NH3 Flow Rate During AlGaN Barrier Layer Growth on the Material Properties of AlGaN/GaN HEMT Heterostructureen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s11664-017-5550-5en_US
dc.identifier.journalJOURNAL OF ELECTRONIC MATERIALSen_US
dc.citation.volume46en_US
dc.citation.spage6104en_US
dc.citation.epage6110en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department國際半導體學院zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentInternational College of Semiconductor Technologyen_US
dc.identifier.wosnumberWOS:000408947000076en_US
Appears in Collections:Articles