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dc.contributor.authorDo, Huy Binhen_US
dc.contributor.authorLuc, Quang Hoen_US
dc.contributor.authorHa, Minh Thien Huuen_US
dc.contributor.authorHuynh, Sa Hoangen_US
dc.contributor.authorNguyen, Tuan Anhen_US
dc.contributor.authorLin, Yueh Chinen_US
dc.contributor.authorChang, Edward Yien_US
dc.date.accessioned2019-04-03T06:43:48Z-
dc.date.available2019-04-03T06:43:48Z-
dc.date.issued2017-08-01en_US
dc.identifier.issn2158-3226en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4986147en_US
dc.identifier.urihttp://hdl.handle.net/11536/146012-
dc.description.abstractThe degeneration of the metal/HfO2\ interfaces for Mo, Ni, and Pd gate metals was studied in this paper. An unstable PdOx interfacial layer formed at the Pd/HfO2 interface, inducing the oxygen segregation for the Pd/HfO2/InGaAs metal oxide capacitor (MOSCAP). The low dissociation energy for the Pd-O bond was the reason for oxygen segregation. The PdOx layer contains O2- and OH- ions which are mobile during thermal annealing and electrical stress test. The phenomenon was not observed for the (Mo,Ni)/HfO2/InGaAs MOSCAPs. The results provide the guidance for choosing the proper metal electrode for the InGaAs based MOSFET. (C) 2017 Author(s).en_US
dc.language.isoen_USen_US
dc.titleStudy of the interface stability of the metal (Mo, Ni, Pd)/HfO2/AlN/InGaAs MOS devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4986147en_US
dc.identifier.journalAIP ADVANCESen_US
dc.citation.volume7en_US
dc.citation.issue8en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.department國際半導體學院zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.contributor.departmentInternational College of Semiconductor Technologyen_US
dc.identifier.wosnumberWOS:000409090200051en_US
dc.citation.woscount1en_US
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