A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Yang, Tsung-Han	en_US
dc.contributor.author	Guo, Zi-Li	en_US
dc.contributor.author	Fu, Yu-Min	en_US
dc.contributor.author	Cheng, Yu-Ting	en_US
dc.contributor.author	Song, Yen-Fang	en_US
dc.contributor.author	Wu, Pu-Wei	en_US
dc.date.accessioned	2018-08-21T05:56:45Z	-
dc.date.available	2018-08-21T05:56:45Z	-
dc.date.issued	2017-01-01	en_US
dc.identifier.issn	1084-6999	en_US
dc.identifier.uri	http://hdl.handle.net/11536/146590	-
dc.description.abstract	The paper presents a low temperature (with 60 degrees C) inkjet printing and filling process to realize low resistive Ag TSV (Through Substrate Vias) with the aspect ratio of via depth vs. diameter from 2 to 5 in a SU-8 substrate potential for flexible microsystem packaging applications. Combining humidity control and layer-by-layer Ag mirror reaction, the proposed process technology can accomplish a fully filled TSV with the lowest electrical resistivity of similar to 450 mu Omega.cm in comparison with the prior printing and filling technologies.	en_US
dc.language.iso	en_US	en_US
dc.title	A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017)	en_US
dc.citation.spage	749	en_US
dc.citation.epage	752	en_US
dc.contributor.department	加速器光源科技與應用學位學程	zh_TW
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Master and Ph.D. Program for Science and Technology of Accelrrator Light Source	en_US
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:000402552000193	en_US
顯示於類別：	會議論文