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dc.contributor.authorChang, Wei-Lingen_US
dc.contributor.authorMeng, Chinchunen_US
dc.contributor.authorHuang, Guo-Weien_US
dc.date.accessioned2018-08-21T05:56:49Z-
dc.date.available2018-08-21T05:56:49Z-
dc.date.issued2016-01-01en_US
dc.identifier.urihttp://hdl.handle.net/11536/146699-
dc.description.abstractThe effect of layout on silicon SBD in CMOS process is studied in this paper. The size of anode area not only affects the series resistance and SBD junction capacitance but also causes serious parasitic effect from cathode to the p-substrate. Typically, an SBD of a small unit anode has a better cut-off frequency than that of a large unit anode. The cutoff frequency of a small anode Schottky diode is about 700 GHz in a standard 0.18 mu m CMOS process. However, a SBD with a small unit anode is prone to the effect of p-substrate to N-well pn junction capacitor. This paper has characterized SBDs of different anode sizes with bottom and side-wall effect of p-substrate to N-well to select an optimal unit-anode area by reducing the substrate effect and providing sufficient f(T) for high frequency applications.en_US
dc.language.isoen_USen_US
dc.subjectSchottky barrier diodeen_US
dc.subjectN-wellen_US
dc.subjectpn junctionen_US
dc.subjectcutoff frequencyen_US
dc.subjectCMOSen_US
dc.subjectmillimeter-waveen_US
dc.titleSBD Layout Optimization with Effect of N-well to p-Substrate pn Junctions in 0.18 mu m CMOS Processen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 ASIA-PACIFIC MICROWAVE CONFERENCE (APMC2016)en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000405560500064en_US
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