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dc.contributor.authorLiu, S. C.en_US
dc.contributor.authorHuang, C. K.en_US
dc.contributor.authorChang, E. Y.en_US
dc.date.accessioned2018-08-21T05:56:51Z-
dc.date.available2018-08-21T05:56:51Z-
dc.date.issued2016-01-01en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://dx.doi.org/10.1149/07205.0019ecsten_US
dc.identifier.urihttp://hdl.handle.net/11536/146738-
dc.description.abstractAn effective SiON passivation with high density of positive fixed charges for GaN MIS-HEMTs is demonstrated. The positive fixed charges at the SiON/AlGaN interface effectively reduce the surface potential and expand the quantum well below the Fermi level, thus improving the device performance. The GaN MIS-HEMT with SiON demonstrated a high maximum drain-source current density (I-DS,I-max) of > 1 A/mm, a breakdown voltage of 750 V at a drain leakage current of 1 mu A/mm, and a well transfer characteristics. The dynamic ON-resistance only increased slightly under a high quiescent bias of 100 V.en_US
dc.language.isoen_USen_US
dc.titleGaN MIS-HEMT with Low Dynamic ON-resistance Using SiON Passivationen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/07205.0019ecsten_US
dc.identifier.journalWIDE BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 17en_US
dc.citation.volume72en_US
dc.citation.spage19en_US
dc.citation.epage21en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000406801600003en_US
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