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dc.contributor.authorChang, Chia-Ling (Lynn)en_US
dc.contributor.authorWen, Charles H. -Pen_US
dc.contributor.authorBhadra, Jayantaen_US
dc.date.accessioned2018-08-21T05:56:55Z-
dc.date.available2018-08-21T05:56:55Z-
dc.date.issued2013-01-01en_US
dc.identifier.issn1530-1591en_US
dc.identifier.urihttp://hdl.handle.net/11536/146839-
dc.description.abstractAlong with the shrinking CMOS process and rapid design scaling, both Iddq values and their variation of chips increase. As a result, the defect leakages become less significant when compared to the full-chip currents, making them more in-distinguishable for traditional Iddq diagnosis. Therefore, in this paper, a new approach called s-Iddq diagnosis is proposed for reinterpreting original data and diagnosing failing chips, intelligently. The overall flow consists of two key components, (1) s-Iddq transformation and (2) defect-syndrome matching: s-Iddq transformation first manifests defect leakages by excluding both the process-variation and design-scaling impacts. Later, defect-syndrome matching applies data mining with a pre-built library to identify types and locations of defects on the fly. Experimental results show that an average of 93.68% accuracy with a resolution of 1.75 defect suspects can be achieved on ISCAS'89 and IWLS'05 benchmark circuits using a 45nm technology, demonstrating the effectiveness of s-Iddq diagnosis.en_US
dc.language.isoen_USen_US
dc.titleProcess-Variation-Aware Iddq Diagnosis for Nano-Scale CMOS Designs - The First Stepen_US
dc.typeProceedings Paperen_US
dc.identifier.journalDESIGN, AUTOMATION & TEST IN EUROPEen_US
dc.citation.spage454en_US
dc.citation.epage457en_US
dc.contributor.department電機工程學系zh_TW
dc.contributor.departmentDepartment of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000415129400087en_US
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