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dc.contributor.authorHsu, Chung-Weien_US
dc.contributor.authorZheng, Xinen_US
dc.contributor.authorWu, Yien_US
dc.contributor.authorHou, Tuo-Hungen_US
dc.contributor.authorWong, H. -S. Philipen_US
dc.date.accessioned2018-08-21T05:56:56Z-
dc.date.available2018-08-21T05:56:56Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://hdl.handle.net/11536/146845-
dc.description.abstractThis paper establishes the correlation between RRAM multilevel-cell (MLC) stochastic SET variability and random telegraph noise (RTN). We show that a smaller diameter (d(D)) of locally connecting/rupturing conductive filament (CF) and larger distance of gap (d(G)) between CF and electrode demonstrate both steeper Weibull slope beta with a relaxed SET-disturb margin by 0.4 V and 36x improvement in RTN robustness. This is achieved by lower current compliances (I-COMP) of 100 mu A and larger RESET stopping voltage (V-RESET) of -4.5 V for smaller dD and larger dG with leaving less residual oxygen vacancies (V-o(+2)) in the gap region. Results from the Kinetic Monte Carlo (KMC) modeling also support these findings.en_US
dc.language.isoen_USen_US
dc.subjectRRAMen_US
dc.subjectSET Variabilityen_US
dc.subjectTDDBen_US
dc.subjectRTNen_US
dc.subjectFilament Morphologyen_US
dc.titleStatistical Study of RRAM MLC SET Variability Induced by Filament Morphologyen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000416068500068en_US
Appears in Collections:Conferences Paper