完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Hsu, Chung-Wei | en_US |
dc.contributor.author | Zheng, Xin | en_US |
dc.contributor.author | Wu, Yi | en_US |
dc.contributor.author | Hou, Tuo-Hung | en_US |
dc.contributor.author | Wong, H. -S. Philip | en_US |
dc.date.accessioned | 2018-08-21T05:56:56Z | - |
dc.date.available | 2018-08-21T05:56:56Z | - |
dc.date.issued | 2017-01-01 | en_US |
dc.identifier.issn | 1541-7026 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/146845 | - |
dc.description.abstract | This paper establishes the correlation between RRAM multilevel-cell (MLC) stochastic SET variability and random telegraph noise (RTN). We show that a smaller diameter (d(D)) of locally connecting/rupturing conductive filament (CF) and larger distance of gap (d(G)) between CF and electrode demonstrate both steeper Weibull slope beta with a relaxed SET-disturb margin by 0.4 V and 36x improvement in RTN robustness. This is achieved by lower current compliances (I-COMP) of 100 mu A and larger RESET stopping voltage (V-RESET) of -4.5 V for smaller dD and larger dG with leaving less residual oxygen vacancies (V-o(+2)) in the gap region. Results from the Kinetic Monte Carlo (KMC) modeling also support these findings. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | RRAM | en_US |
dc.subject | SET Variability | en_US |
dc.subject | TDDB | en_US |
dc.subject | RTN | en_US |
dc.subject | Filament Morphology | en_US |
dc.title | Statistical Study of RRAM MLC SET Variability Induced by Filament Morphology | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000416068500068 | en_US |
顯示於類別: | 會議論文 |