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dc.contributor.authorLin, Hsin-Tzuen_US
dc.contributor.authorWu, Yi-Chungen_US
dc.contributor.authorHsieh, Ping-Hsuanen_US
dc.contributor.authorYang, Chia-Hsiangen_US
dc.date.accessioned2018-08-21T05:57:00Z-
dc.date.available2018-08-21T05:57:00Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn0271-4302en_US
dc.identifier.urihttp://hdl.handle.net/11536/146923-
dc.description.abstractThis paper presents an integration of energy-recycling logic circuits with a wireless power transfer receiving module for ultra-low-power applications, such as transcutaneous biomedical implantables. In the prototype design, one inductive coil implanted inside the body receives wireless power and supplies the following electronics. While part of the loading is composed of conventional CMOS logics, the rest is implemented with energy-recycling logic circuits. Energy-recycling logic and the associated adiabatic operation achieve excellent energy efficiency by transferring and recycling energy between digital logic blocks along with the signal propagation. The required AC supplies further lead to a natural integration with wireless power transfer and therefore obviate the need for a rectifier that contributes to substantial power loss. As a proof of concept, a finite-impulse-response filter is designed in 90-nm CMOS process. Simulation results show a 59.3% power reduction as compared to static CMOS counterpart.en_US
dc.language.isoen_USen_US
dc.titleIntegration of Energy-Recycling Logic and Wireless Power Transfer for Ultra-Low-Power Implantablesen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2017 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS)en_US
dc.citation.spage577en_US
dc.citation.epage580en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000424890100139en_US
Appears in Collections:Conferences Paper