完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Tu, Cheng | en_US |
dc.contributor.author | Liu, Chin-Liang | en_US |
dc.contributor.author | Lee, Meng-Shiue | en_US |
dc.contributor.author | Hsu, Wensyang | en_US |
dc.date.accessioned | 2018-08-21T05:57:01Z | - |
dc.date.available | 2018-08-21T05:57:01Z | - |
dc.date.issued | 2017-01-01 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/146943 | - |
dc.description.abstract | From traditional manufacturing to integrated circuit technology, shaft components have been utilized in different kinds of industries. Therefore, torsion monitoring to maintain the precision of machines is an important task. However, in order to check the performance, the shaft component needs to be dismounted from working position and installed in an expensive testing system for further diagnoses, which is labor-consuming and inefficient. In this study, we proposed a passive, wireless smart LC sensing tag based on the developed LC technology produced by commercial aluminum foil lamination and fast slitting techniques. With this smart tag fixed on the shaft, the torque generated by the system can be monitored, since the resonance frequency, shifting accordingly to the change of torque, can be readable by RF coils' inducting. Therefore, the smart LC sensing tag can work wirelessly and passively without physically connecting to a battery or power module. The goal of this study is to monitor stress at least 0.0056 epsilon by using the portable antenna analyzer which has the resolution about 1.3113 MHz/epsilon. This technology has the great vision that applies to the shaft monitoring in vehicles or fabrication machines. Furthermore, it can be integrated into IOT application. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | wireless transition | en_US |
dc.subject | LC Circuit | en_US |
dc.subject | interdigital capacitor | en_US |
dc.subject | passive components | en_US |
dc.subject | lamination fabrication | en_US |
dc.title | Passive and Wireless Strain Sensor based on LC Circuit with Lamination Fabrication | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2017 IEEE 12TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS) | en_US |
dc.citation.spage | 303 | en_US |
dc.citation.epage | 306 | en_US |
dc.contributor.department | 機械工程學系 | zh_TW |
dc.contributor.department | Department of Mechanical Engineering | en_US |
dc.identifier.wosnumber | WOS:000425214800188 | en_US |
顯示於類別: | 會議論文 |