Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu

doi:10.1016/j.scriptamat.2011.08.008

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DC 欄位	值	語言
dc.contributor.author	Hsiao, H. -Y.	en_US
dc.contributor.author	Hu, C. -C.	en_US
dc.contributor.author	Guo, M. -Y.	en_US
dc.contributor.author	Chen, C.	en_US
dc.contributor.author	Tu, K. N.	en_US
dc.date.accessioned	2014-12-08T15:20:40Z	-
dc.date.available	2014-12-08T15:20:40Z	-
dc.date.issued	2011-11-01	en_US
dc.identifier.issn	1359-6462	en_US
dc.identifier.uri	http://dx.doi.org/10.1016/j.scriptamat.2011.08.008	en_US
dc.identifier.uri	http://hdl.handle.net/11536/14700	-
dc.description.abstract	An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu(6)Sn(5) inter-metallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.subject	Intermetallic compound	en_US
dc.subject	Soldering	en_US
dc.subject	Diffusion	en_US
dc.subject	3D-IC packaging	en_US
dc.title	Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1016/j.scriptamat.2011.08.008	en_US
dc.identifier.journal	SCRIPTA MATERIALIA	en_US
dc.citation.volume	65	en_US
dc.citation.issue	10	en_US
dc.citation.spage	907	en_US
dc.citation.epage	910	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000296002900015	-
dc.citation.woscount	5	-
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