完整後設資料紀錄
DC 欄位語言
dc.contributor.authorNg, Herman Jallien_US
dc.contributor.authorAhmad, Waelen_US
dc.contributor.authorKucharski, Maciejen_US
dc.contributor.authorLu, Jeng-Hauen_US
dc.contributor.authorKissinger, Dietmaren_US
dc.date.accessioned2018-08-21T05:57:07Z-
dc.date.available2018-08-21T05:57:07Z-
dc.date.issued2017-01-01en_US
dc.identifier.issn1529-2517en_US
dc.identifier.urihttp://hdl.handle.net/11536/147063-
dc.description.abstractThis paper describes a miniaturized 2-channel system-on-chip radar sensor in a SiGe BiCMOS technology. It includes on-chip folded dipole antennas that utilize a localized backside etching technique with a novel selective etching approach that is able to improve the radiation efficiency and the mechanical stability of the chip. The transceiver is equipped with a 30-GHz VCO that is complemented with a frequency quadrupler to generate a 120-GHz carrier signal. The 2 transmit channels can be combined to increase the effective isotropic radiated power by 6 dB and to implement a SIMO radar. The transceiver also includes BPSK modulators as well as I/Q receivers and can be utilized to build a flexible MIMO radar using frequency-modulated continuous-wave with time and delta-sigma modulator-based frequency division multiplexing as well as pseudo-random noise radar techniques. Radar measurement using digital-beamforming method with 10-GHz modulation bandwidth was performed to show the applicabilty of the proposed system.en_US
dc.language.isoen_USen_US
dc.subjectSystem-on-chipen_US
dc.subjectSIMO radaren_US
dc.subjectMIMO radaren_US
dc.subjectmillimeter-wave radaren_US
dc.subjectdigital beamformingen_US
dc.subjecton-chip antennaen_US
dc.titleHighly-Miniaturized 2-Channel mm-Wave Radar Sensor with On-Chip Folded Dipole Antennasen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2017 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM (RFIC)en_US
dc.citation.spage368en_US
dc.citation.epage371en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000426956400093en_US
顯示於類別:會議論文