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dc.contributor.authorPeiris, Roshan Lalinthaen_US
dc.contributor.authorPeng, Weien_US
dc.contributor.authorChen, Zikunen_US
dc.contributor.authorChan, Liweien_US
dc.contributor.authorMinamizawa, Koutaen_US
dc.date.accessioned2018-08-21T05:57:07Z-
dc.date.available2018-08-21T05:57:07Z-
dc.date.issued2017-01-01en_US
dc.identifier.urihttp://dx.doi.org/10.1145/3025453.3025824en_US
dc.identifier.urihttp://hdl.handle.net/11536/147076-
dc.description.abstractHead Mounted Displays (HMDs) provide a promising opportunity for providing haptic feedback on the head for an enhanced immersive experience. In ThermoVR, we integrated five thermal feedback modules on the HMD to provide thermal feedback directly onto the user's face. We conducted evaluations with 15 participants using two approaches: Firstly, we provided simultaneously actuated thermal stimulations (hot and cold) as directional cues and evaluated the accuracy of recognition; secondly, we evaluated the overall immersive thermal experience that the users experience when provided with thermal feedback on the face. Results indicated that the recognition accuracy for cold stimuli were of approx. 89.5% accuracy while the accuracy for hot stimuli were 68.6%. Also, participants reported that they felt a higher level of immersion on the face when all modules were simultaneously stimulated (hot and cold). The presented applications demonstrate the ThermoVR's directional cueing and immersive experience.en_US
dc.language.isoen_USen_US
dc.subjectthermal displayen_US
dc.subjectthermal hapticsen_US
dc.subjecthead mounted displayen_US
dc.titleThermoVR: Exploring Integrated Thermal Haptic Feedback with Head Mounted Displaysen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1145/3025453.3025824en_US
dc.identifier.journalPROCEEDINGS OF THE 2017 ACM SIGCHI CONFERENCE ON HUMAN FACTORS IN COMPUTING SYSTEMS (CHI'17)en_US
dc.citation.spage5452en_US
dc.citation.epage5456en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000426970505027en_US
Appears in Collections:Conferences Paper