Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hsieh, Ting-En | en_US |
dc.contributor.author | Chang, Edward Yi | en_US |
dc.contributor.author | Song, Yi-Zuo | en_US |
dc.contributor.author | Lin, Yueh-Chin | en_US |
dc.contributor.author | Wang, Huan-Chung | en_US |
dc.contributor.author | Liu, Shin-Chien | en_US |
dc.contributor.author | Salahuddin, Sayeef | en_US |
dc.contributor.author | Hu, Chenming Calvin | en_US |
dc.date.accessioned | 2019-04-02T06:00:51Z | - |
dc.date.available | 2019-04-02T06:00:51Z | - |
dc.date.issued | 2014-07-01 | en_US |
dc.identifier.issn | 0741-3106 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/LED.2014.2321003 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/147714 | - |
dc.description.abstract | In this letter, a gate recessed normally OFF AlGaN/GaN MIS-HEMT with low threshold voltage hysteresis using Al2O3/AlN stack gate insulator is presented. The trapping effect of Al2O3/GaN interface was effectively reduced with the insertion of 2-nm AlN thin interfacial passivation layer grown by plasma enhanced atomic layer deposition. The device exhibits a threshold voltage of +1.5 V, with current density of 420 mA/mm, an OFF-state breakdown voltage of 600 V, and high ON/OFF drain current ratio of similar to 10(9). | en_US |
dc.language.iso | en_US | en_US |
dc.subject | GaN | en_US |
dc.subject | metal-insulator-semiconductor high electron-mobility transistor (MIS-HEMT) | en_US |
dc.subject | normally-OFF | en_US |
dc.subject | gate recessed | en_US |
dc.subject | gate insulator | en_US |
dc.subject | threshold voltage hysteresis | en_US |
dc.subject | Al2O3 and AlN | en_US |
dc.subject | plasma enhanced atomic layer deposition (PE-ALD) | en_US |
dc.subject | interfacial passivation layer (IPL) | en_US |
dc.title | Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/LED.2014.2321003 | en_US |
dc.identifier.journal | IEEE ELECTRON DEVICE LETTERS | en_US |
dc.citation.volume | 35 | en_US |
dc.citation.spage | 732 | en_US |
dc.citation.epage | 734 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000338662100015 | en_US |
dc.citation.woscount | 53 | en_US |
Appears in Collections: | Articles |