Full metadata record
DC FieldValueLanguage
dc.contributor.authorChou, BCSen_US
dc.contributor.authorChen, CNen_US
dc.contributor.authorShie, JSen_US
dc.date.accessioned2019-04-02T05:58:47Z-
dc.date.available2019-04-02T05:58:47Z-
dc.date.issued1999-01-01en_US
dc.identifier.issn0914-4935en_US
dc.identifier.urihttp://hdl.handle.net/11536/148446-
dc.description.abstractA Pirani vacuum sensor with a shallow gap between its heated element and its surrounding substrate heat-sink was fabricated using polysilicon as a sacrificial layer. The polysilicon was post-etched by TMAH solution, and an anti-stiction method was used in several steps of the process including a crucial freeze-drying one. The smallest spacing in this device is 0.3 mu m, and via this narrow gap, the heat conductance from the gas-molecule-collisions from the hot element to the heat sink is greatly enhanced in the atmospheric pressure regime. Therefore, this Pirani vacuum sensor is capable of detecting gas pressure linearly up to around 7 bars. As for the low-pressure regime, a partial dummy compensation method reduces the ambient temperature drift effectively and pressure lower than 10(-3) Torr was measurable. Moreover, device packaging was also studied to protect the tiny sensor from any contamination including dust and particles.en_US
dc.language.isoen_USen_US
dc.subjectPirani vacuum sensoren_US
dc.subjectsacrificial layeren_US
dc.subjectTMAHen_US
dc.subjectfreeze-dryingen_US
dc.subjectpackagingen_US
dc.titleFabrication and study of a shallow-gap Pirani vacuum sensor with a linearly measurable atmospheric pressure rangeen_US
dc.typeArticleen_US
dc.identifier.journalSENSORS AND MATERIALSen_US
dc.citation.volume11en_US
dc.citation.spage383en_US
dc.citation.epage392en_US
dc.contributor.department光電工程研究所zh_TW
dc.contributor.departmentInstitute of EO Enginerringen_US
dc.identifier.wosnumberWOS:000084226700007en_US
dc.citation.woscount4en_US
Appears in Collections:Articles