Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

doi:10.1016/j.matlet.2018.10.112

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Shen, Yu-An	en_US
dc.contributor.author	Ouyang, Fan-Yi	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2019-04-02T05:59:10Z	-
dc.date.available	2019-04-02T05:59:10Z	-
dc.date.issued	2019-02-01	en_US
dc.identifier.issn	0167-577X	en_US
dc.identifier.uri	http://dx.doi.org/10.1016/j.matlet.2018.10.112	en_US
dc.identifier.uri	http://hdl.handle.net/11536/148480	-
dc.description.abstract	The effect of Sn orientation on thermomigration was investigated in Cu/Sn2.3Ag/Ni microbumps with diameter of 20 mu m. Results showed that anisotropic diffusion of Cu in Sn grains affected both formation rates and locations of Cu6Sn5 intermetallic compounds (IMCs). Rapid growth of Cu6Sn5 IMCs at the coldend interface was observed when the c-axis of Sn grains was parallel to the temperature gradient. In addition, diffusion of Cu atoms was blocked by a Sn grain with a high angle between the Sn c-axis and the thermal gradient, resulting in formation of Cu6Sn5 IMCs near the grain boundary inside the solder. (C) 2018 Elsevier B.V. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.subject	Diffusion	en_US
dc.subject	Grain boundary	en_US
dc.subject	Grain orientation	en_US
dc.subject	Intermetallic compounds	en_US
dc.subject	Thermomigration	en_US
dc.title	Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1016/j.matlet.2018.10.112	en_US
dc.identifier.journal	MATERIALS LETTERS	en_US
dc.citation.volume	236	en_US
dc.citation.spage	190	en_US
dc.citation.epage	193	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000450594300049	en_US
dc.citation.woscount	2	en_US
顯示於類別：	期刊論文