標題: Color Quality Improvement of Micro LED Display Image by TMP LED Design
作者: Lee, Hsiao-Wen
Wang, Ting-Jay
Lin, Bor-Shyh
交大名義發表
光電系統研究所
影像與生醫光電研究所
National Chiao Tung University
Institute of Photonic System
Institute of Imaging and Biomedical Photonics
關鍵字: Thin film devices;thermal management of electronics;electronic packaging thermal
公開日期: 1-一月-2018
摘要: In recent years, Micro LED technology has been popularly developed. How to improve the issue of color stability in Micro LED technology is an important and also a difficult research topic. Here, the brightness decay and color displacement in high chip temperature are the two major factors in the color quality of Micro LED display image. In this paper, the technique of thin metal package is applied in the LED package to effectively improve the material thermal resistance of the LED package. By improving the material thermal resistance of the LED package, it could improve the brightness decay 5% in LED high junction temperature. The proposed method could reduce 0.01 of Cx displacement in LED high junction temperature and control Cy displacement less than 0.005 in chip junction temperature 45 degrees to 110 degrees. From the experimental results, the proposed method could exactly improve the color quality of quantum well Micro LED display image in high temperature.
URI: http://dx.doi.org/10.1109/ACCESS.2018.2880090
http://hdl.handle.net/11536/148598
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2018.2880090
期刊: IEEE ACCESS
Volume: 6
起始頁: 70122
結束頁: 70129
顯示於類別:期刊論文