A NOVEL LIQUID-PACKAGING TECHNOLOGY FOR HIGHLY RELIABLE UV-LED ENCAPSULATION

Abstract

This paper proposes a liquid-packaging technology for UV LED. Unlike the traditional packaging methods that involve thermosetting silicon or quartz glass, the proposed method primarily uses silicon oil to directly contact the chip, which prevents erosion due to moisture or oxygen. In this study, UV LEDs with high heat dissipation technology were selected, and the experimental results of optical and thermal management were compared between the general packaging and liquid-packaging structures, respectively. The results of the optical experiments showed that the proposed method increases the extraction efficiency by 9.5%. The results of the heat dissipation experiments showed that the liquid-packaging technology can reduce the thermal resistance of the UV-LED package by 31%.