完整後設資料紀錄
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dc.contributor.authorWang, Tai-Yuanen_US
dc.contributor.authorTseng, Po-Yingen_US
dc.contributor.authorTsai, Jia-Linen_US
dc.date.accessioned2019-04-02T05:58:12Z-
dc.date.available2019-04-02T05:58:12Z-
dc.date.issued2019-03-01en_US
dc.identifier.issn0021-9983en_US
dc.identifier.urihttp://dx.doi.org/10.1177/0021998318791681en_US
dc.identifier.urihttp://hdl.handle.net/11536/148884-
dc.description.abstractAtomistic simulation together with micromechanical analysis was employed to characterize the Young's modulus and thermal conductivity of graphene/epoxy nanocomposites. Nanocomposites containing pristine graphene, carboxyl (COOH)-functionalized graphene, and COOH- and amine (NH2)-functionalized graphene were considered in the simulations. The effect of atomistic interaction between the graphene and the surrounding epoxy was accounted for in the molecular dynamics simulations and then used to derive the effective properties of graphene. Subsequently, the Young's modulus and thermal conductivity of nanocomposites containing randomly oriented graphene were modeled using the Mori-Tanaka micromechanical model. The results indicated that the COOH- and NH2-functionalized graphene nanocomposite had superior mechanical and thermal properties to the other two material systems. Moreover, the model predictions were in favorable agreement with the experimental data.en_US
dc.language.isoen_USen_US
dc.subjectMultiscale modelingen_US
dc.subjectthermal conductivityen_US
dc.subjectgraphene/epoxy nanocompositesen_US
dc.titleCharacterization of Young's modulus and thermal conductivity of graphene/epoxy nanocompositesen_US
dc.typeArticleen_US
dc.identifier.doi10.1177/0021998318791681en_US
dc.identifier.journalJOURNAL OF COMPOSITE MATERIALSen_US
dc.citation.volume53en_US
dc.citation.spage835en_US
dc.citation.epage847en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000458847600010en_US
dc.citation.woscount0en_US
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